We are looking for a Mechanical Engineer with expertise in electronic packaging and enclosure design to be part of a cross-functional team whose mission is to lead IonQ on its journey to build the world's best quantum computers to solve the world's most complex problems.
In this role, you will be responsible for the mechanical design, analysis, and testing of enclosures and packaging solutions for electronic devices and subsystems that are used to control the qubits at the core of our computers. You will collaborate closely with electrical engineers, industrial designers, and manufacturing teams to develop robust, functional, and aesthetically pleasing products.
Responsibilities:
- Design and develop mechanical enclosures and packaging for electronic assemblies, considering factors such as thermal management, EMI/RFI shielding, vibration and shock resistance, and manufacturability.
- Create detailed 3D CAD models and 2D drawings of enclosures, components, and assemblies using software such as SolidWorks.
- Perform structural and thermal analysis (FEA/CFD) to ensure design integrity and performance under various operating conditions.
- Select appropriate materials and manufacturing processes (e.g., injection molding, sheet metal fabrication, die casting) based on performance requirements, cost, and production volume.
- Work closely with electrical engineers to ensure proper integration of electronic components, cable routing, and connector placement within the enclosure.
- Develop and execute testing protocols to validate the mechanical integrity, thermal performance, and environmental resilience of enclosures and packaging.
- Generate detailed Bill of Materials (BOMs) and documentation for manufacturing.
- Participate in design reviews and provide constructive feedback.
You'd be a good fit with:
- Bachelor's degree in Mechanical Engineering or a related field
- 15+ years of professional experience or an equivalent combination of education and experience
- Minimum of 10 years of experience in mechanical design, with a focus on electronic packaging and enclosure design
- Proficiency in 3D CAD software (e.g., SolidWorks)
- Understanding of material properties, manufacturing processes, and assembly techniques relevant to electronic enclosures
- Familiarity with thermal management principles for electronic devices
You'd be a great fit with:
- 15+ years of experience in mechanical design with a focus on electronic packaging
- Experience with FEA and CFD software for structural and thermal analysis (e.g., ANSYS, COMSOL)
- Experience with micro-electronic packaging
- Knowledge of EMI/RFI shielding techniques and design considerations
- Experience with designing for precision instrumentation in laboratory environments
- Familiarity with rapid prototyping techniques (e.g., 3D printing)
- Experience with product lifecycle management (PLM) systems
Location: This role is onsite in College Park, MD, with the possibility to work from home 1-2 days/week
Travel: Less than 10%
Job ID: 1050
The approximate base salary range for this position is $123,191 - $161,289. The total compensation package includes base, bonus, and equity.