Packaging Design Engineer

IBM Quantum is seeking talented engineers to join the quantum hardware design/simulation team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. The team focuses on delivering quantum processor and processor-adjacent designs to meet a variety of internal needs, and develops and drives the methodology to make these designs successful. Designs span in scope from exploratory research to production-roadmap quantum processor unit development. The successful candidate will join the cross-disciplinary engineering research team focused on developing the next generation of packaging and system-level interconnect for IBM Quantum's quantum processing units. The role will own complex first- and second-level packaging designs from conception through to execution, including physical design, and work closely with stakeholders up and down the stack to refine the end-to-end quantum computing system assembly. Experience with industry-grade laminate and PCB design tools (Cadence Allegro/APD suite, Mentor Expedition PCB, Altium Designer etc.) is required. Experience with simulation of either/both electromagnetic characteristics and thermal characteristics is a strong bonus. Because the role includes collaboration between several diverse and dynamic teams of technical and operations personnel, good communication skills, initiative, and a strong sense of responsibility are key.Responsibilities include:* Physical design of laminates and PCBs.* Conversion of high-level specifications to low-level design details.* Validating laminate/PCB designs for electromagnetic (signal integrity/power integrity) performance.* Validating laminate/PCB designs for thermal performance.* Collaboration with chip design teams and system integration to drive I/O interface definitions.