Silicon Packaging Architect

Job Details: Job Description:

About the Group:

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we established Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and major provider of US and European based capacity to serve customers globally. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

This business unit is completely dedicated to the success of its customers with full P&L responsibilities. This model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. FS is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications.

About the Role:
We're looking for a motivated, passionate, and talented Engineer to join Intel's Advanced Design Technology and Solutions (ADTS) group as a Silicon Packaging Architect.

Responsibilities

• Define Package Architecture across Intel's product portfolios (CPUs, Chipsets, SOC designs and more) as part of the Assembly and Test Technology Development group.
• Work with the Si and Board design teams to define and implement a co-design strategy which would optimize product performance and cost at the package and system level.
• Understand packaging technology development FMEAs and product packaging requirements - both physical and electrical.
• Work closely with Intel and external customers on advanced design nodes to establish design flows for advanced package architectures.
• Direct technical aspects of the Package Architecture process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts.
• Collaborate with EDA partners on advancing package design tools and identify most efficient design methods and serve as the technical expert on advanced package architectures and design tools as well as consult on design and implementation issues.
• Work with a cross functional team including silicon IP design, package and PCB platform to define and co-optimize package solutions. This position determines creative design approaches and solutions based on formal education and judgement, works with the design and layout teams to implement those solutions.

Required Background and Experience:

• Good technical understanding in the areas of Si +Package - Board interaction.
• Solid background in semiconductor fabrication and packaging
• Self-motivated engineer who has strong technical background in both design and electrical analysis.
• Experience with design and simulation tools.
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
• Strong organization, time management, and communication skills, self-motivated.
• Exhibit the following behavioral traits:
  • Strong analytical ability and problem-solving skills like identifying, isolating, and debugging issues and providing creative solutions.
  • Ability to work independently and at various levels of abstraction.

Qualifications:

Required Qualifications:

• US Citizenship required.
• Ability to obtain a US Government Security Clearance
• Ph.D. or masters in electrical engineering, chemical engineering, mechanical engineering, material science or similar field.
• 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.

Preferred Qualifications:

• Active US Government Security Clearance with a minimal of a Secret Level.
• Experience and knowledge with assembly process, test and characterization techniques.

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in the US:

$214,730.00-$303,140.00

S al ary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.