Senior Design Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Are you ready to shape the future of Wi-Fi connectivity? Qorvo's Connectivity Components Business Unit (CCBU) develops advanced Wi-Fi and IoT Front End solutions that boost wireless connectivity in homes, enterprises and smartphones. Our innovative products, including Wi-Fi and IoT FEMs, iFEMs and filters, enable faster downloads and seamless multi-device connections without performance loss. Be part of the team that develops products and solutions that are driving the future of IoT/CIoT and all Wi-Fi standards.

CCBU is part of the Connectivity & Sensors Group (CSG) at Qorvo. CSG is a leading global supplier of connectivity systems and components, including Ultra-Wideband, Bluetooth, Matter, Wi-Fi, cellular IoT and MEMS sensors. Markets for CSG include smart home, automotive connectivity, industrial automation, smartphones, wearables, gaming and other high-growth IoT connectivity and healthcare market segments.

OVERVIEW:

We are looking for a motivated Senior Laminate/Module Design Engineer to join our Connectivity Components Business Unit (CCBU). Reporting to Design Engineering Management, the Design Engineer will be responsible for the laminate/module designs of RF front-end modules for Wi-Fi applications. The Design Engineer will help drive engineering decisions and lead the design and development of module layout and floor planning, laminate design, module integration, and simulation for Wi-Fi RF front-end modules that include linear and/or non-linear power amplifiers (PAs), Low Noise Amplifiers (LNAs), switches, and filters. The Design Engineer will work closely with a core design engineering team and other cross-functional team members to bring cutting edge Wi-Fi products to the market.

KEY RESPONSIBILITIES:

• Create detailed, module-level laminate designs for next generation Wi-Fi RF front-end modules that include power amplifiers, low-noise amplifiers, switches, and/or filters for 2.4GHz, 5GHz, 6GHz, and/or 5-7GHz Wi-Fi applications.
• Collaborate with Engineering and Marketing Managers to define product requirements.
• Determine design approaches targeting key module parameter specifications.
• Lead module and/or laminate design reviews, including assembly specifications and/or requirements.
• Assist with hands-on laboratory work including testing, RF tuning, and data analysis.
• Create and execute product development plans including design, simulation, layout, and verification testing.
• Provide product development support for RF front-end modules targeting 2.4GHz, 5GHz, 6GHz, and/or 5-7GHz Wi-Fi applications.
• Collaborate with cross-functional team members to bring products from conception to full production release.
• Identify and address design risks and challenges to meet performance metrics.
• Support Product Marketing and Applications Engineering throughout the product development lifecycle with product prototypes and samples, data and design summaries, and application circuit recommendations.

QUALIFICATIONS:

• A minimum of a Bachelors degree in an Electrical Engineering discipline, Masters Degree preferred
• A minimum of 5 years of RF industry experience, with previous Module design experience preferred
• Proficient with RFIC and module EDA tools (Keysight ADS and/or Cadence) to design and simulate RF multi-chip modules
• Proficient with EM simulator tools (ADS Momentum or FEM, Cadence EMX, and/or Ansyss HFSS) to design and simulate RF multi-chip modules
• History of successfully designing and production-releasing state-of-the art front-end modules that incorporate RFIC designs in GaAs, GaN, SiGe, RF CMOS, and/or SOI technologies
• Prior experience with analytic tools (Tibco Spotfire, JMP, or others) for data analysis
• Experience in designing modules with an understanding of thermal management for power amplifiers
• Prior experience in laboratory settings, including testing and RF tuning
• Ability to work in a fast-paced, highly-motivated, and very interactive team environment
• History of effectively communicating ideas and design progress/status in-person as well as in presentations and written reports
• Fundamental transistor-level knowledge of RF and microwave integrated circuit design techniques, including RF power amplifiers and/or bias circuits
• Knowledge and/or experience with nonlinear power amplifier architectures for digital predistortion applications

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MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.